ST Engineering and Ramco Systems signs MoU for long term partnership

Singapore, 6th February 2026 :

Ramco Systems has announced that it has signed a Memorandum of Understanding (MoU) with the Commercial Aerospace business of ST Engineering, to explore a long-term strategic business and technology partnership aimed at building the next generation of digital solutions for the global aerospace industry.

As part of the MoU, ST Engineering and Ramco will study the feasibility of setting up a jointly operated Competency Centre and Innovation Lab in Singapore. This facility will serve as a focal point for driving digital innovation and AI-enabled solutions across key areas of aviation MRO.

The collaboration brings together ST Engineering’s extensive domain expertise across Airframe, Engine, and Component MRO, as well as its OEM and engineering solutions including nacelles design and manufacturing, cabin interiors and passenger to freighter conversion, with Ramco’s purpose-built aviation product and agentic AI platform capabilities.

Jeffrey Lam, President Commercial Aerospace, ST Engineering, said: “This potential collaboration builds on our ongoing digital transformation journey. By pairing our operational experience and know-how with Ramco’s aviation and AI expertise, we can unlock new avenues to boost MRO efficiency and further enhance the value delivered to our customers.”

Sandesh Bilagi, President & COO, Ramco Systems, said, “We are delighted to partner with ST Engineering, a global leader in commercial aerospace services, to shape the next generation of digital aviation platforms. Ramco will support this initiative with its aviation product suite and AI-driven platforms, enabling the agility, regulatory compliance, and operational depth required to scale with confidence. This collaboration reflects our shared vision of working with industry leaders like ST Engineering to co-create future-ready solutions for the aviation ecosystem.”

The banner image includes:(L-R) Jeffrey Lam, President Commercial Aerospace, ST Engineering, and P.R. Venketrama Raja, Chairman, Ramco Group, during the signing ceremony held at the Singapore Airshow 2026.

FOREWORD

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